Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Dow’s Asia CMP Center Celebrates Phase 4 Grand Opening

April 19, 2018

Cliff Chen welcomes guests to Dow’s Asia CMP Center Phase 4 Grand OpeningDow Electronic Materials is expanding manufacturing operations for the production of pads for chemical mechanical planarization (CMP). Read on to see photos from the grand opening ceremony.

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MICROFILL™ SFP Acid Copper Earns Dow its Ninth NPI Award in 10 Years

April 09, 2018

Photo of Dow’s 9th PCD&F Award honoring Microfill SFP Acid Copper.Industry awards are one of the strongest endorsements of a company’s products, especially when judged by peers. Dow is honored to receive it’s ninth PCD&F NPI Award this year for MICROFILL™ SFP Acid Copper.

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2018 Outlook: A Vision for the Semiconductor Industry in China

March 20, 2018

A woman using her smartphone against the Beijing skyline serves as a  reminder of opportunities for continued growth in China’s semiconductor industry.Dow’s Shuji Ding-Lee talks with Semiconductor Manufacturing China about market dynamics and opportunities for semiconductor industry growth in China in 2018.

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A market outlook: Will OLEDs Prevail in 2018 Display Markets?

March 15, 2018

The display market is exciting with innovative technology on the horizon like flexible OLED displays. The display market is in a period of transition, with LCD displays unstable, QDs a bit unknown and OLEDs seemingly in the driver’s seat. Dow’s Hwang shares his thoughts on this exciting market.

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2018 Semiconductor Industry Outlook: Riding a Growth Trend

March 13, 2018

A businessman sits in a chair contemplating the semiconductor industry outlook.Dow’s Adam Manzonie gives his insight on what may extend the semiconductor industry’s growth in 2018. Overall product quality from material suppliers is key in 2018 to meet ever more stringent process control requirements.

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Dow Litho and CMP Experts to Present Research at SEMICON China’s CSTIC

March 09, 2018

A view of the Shanghai International Convention Center, host of CSTIC 2018During the China Semiconductor Technology International Conference (CSTIC), representatives from Dow will share research on two topics: patterning materials for advanced 193nm immersion lithography, and the relationship between pad and slurry in CMP process optimization.

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3D InCites: It’s Time to Get Serious About (Advanced Packaging for) 5G

March 08, 2018

Advanced packaging as the key to 5GDow’s Rob Kavanagh discusses how advanced packaging will be a key asset for the development of 5G and the connectivity of all IoT devices. With the strict design and materials requirements for 5G, this proposes some challenges as well as opportunity for the semiconductor industry.

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IMAPS DPC 2018 to Explore the Future of Advanced Packaging

February 26, 2018

The future of advanced packagingIMAPS Device Packaging Conference is always at the forefront of semiconductor advanced packaging, and this year, it will look into the future. Check out Dow presentations from Dow experts during this year’s event.

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Dow’s Peter Trefonas Named SPIE Fellow

February 26, 2018

TrefonasThumbnailDow’s Peter Trefonas has been named a Fellow of SPIE, the international society for optics and photonics. Trefonas has been recognized for his achievements in design for manufacturing and compact modeling.

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SPN Viewpoint 2018: The Fan-Out Conversation and Memory Growth Continue

February 15, 2018

Teardown of a modern mobile device highlights a number of relevant 2018 advanced packaging trends.In this look ahead to 2018, Rob Kavanagh discusses advanced packaging trends for 2018. With the memory market is on the rise, advanced packaging suppliers will be faced with more challenges.

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