Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Advances in Patterning Materials and Processes at SPIE Advanced Lithography

February 20, 2017

SPIE Advanced Lithography takes place Feb. 26 to Mar. 2, 2017 in San Jose, California.

Dow experts will present at this year’s SPIE Advanced Lithography as part of Advances in Patterning Materials and Processes Conference. Preview our presentations on embedded topcoat for EUV and soft spacer materials for advanced hole patterning.

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2017 Outlook: Semiconductor Market Forecast Calls for Continued Collaboration

February 16, 2017

Business executives collaborate on a project in a conference room. This year’s semiconductor market forecast calls for continued industry collaboration.
The semiconductor market forecast is strong for 2017. Dow's Colin Cameron discusses market drivers and the value of continued collaboration in an editorial for Solid State Technology.

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New Nanorod LED Technology Responds to Light Input

February 15, 2017

In this lab demonstration, a researcher shows the nanorod LED technology’s ability to respond to a light stylus.

Novel LED technology could create new possibilities for interacting with displays. Researchers from Dow Electronic Materials and the University of Illinois at Urbana-Champaign report on nanorod LED arrays that could be used to bring displays to life.

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Will Fan-out Panel-Level Packaging Really Happen?

February 14, 2017

Fan-out panel-level packaging offers the advanced semiconductor packaging industry an opportunity for lower-cost, higher-volume manufacturing to enable the next generation of high performance devices.

The advanced semiconductor packaging industry is considering a shift to fan-out panel-level packaging. Here, Dow’s Rozalia Beica and Monita Pau examine the challenges this new technology is facing.

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Dow to Present at Inaugural Electron Devices Technology and Manufacturing Conference

February 09, 2017

The Electron Devices Technology Manufacturing Conference will take place for the first time in 2017.

The Electron Devices Technology Manufacturing Conference came about from the industry’s increased interest in how system integration improves device performance. This year, Dow offers its take on advanced materials and interconnect technologies for next-gen smart devices.

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Why Converting Tin Electroplating Lines Makes Sense Now

February 07, 2017

Converting to new tin electroplating lines provides benefits in cost, quality and environmental safety

Increasing concerns about toxicity and materials waste when tin-plating steel pose compelling reasons to convert existing PSA/ENSA plating lines to MSA, which provides benefits in cost, quality and environmental safety.

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2017 Outlook: Lithography Materials Support Growth in China

January 31, 2017

A tree grows in urban China, representative of growth in many industries. Lithography materials will be an enabler for semiconductor industry growth in China in 2017.

Shuji Ding-Lee discusses the role lithography materials play in enabling next-gen technologies, as well as the growth of China’s IC market and requirements for materials suppliers.

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Transitioning to Chromium-Free Etch Technology for Plating on Plastics

January 24, 2017

plating_on_plastics

Dow reports on its progress towards a plating on plastics (POP) process free from hexavalent chromium to comply with REACH legislation.

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The Science Behind the Screen: LCD TVs Keep Getting Better

January 23, 2017

The science behind LCD TVs continues to evolve to keep LCD displays competitive

This post examines the benefits of the latest TFT technology for next-gen displays, specifically, the impact of organic insulator (NPL) materials, which are becoming indispensable for large, high-resolution, high-contrast LCD TVs.

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Dow to Present on Packaging for Smart Devices at European 3D Summit

January 19, 2017

Dow to Present on Packaging for Smart Devices at European 3D Summit

At the European 3D Summit, Dow Electronic Materials’ Rozalia Beica takes a deeper look at global trends driving advanced packaging, highlighting applications, today’s technologies and future trends.

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