Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Becoming REACH Compliant: Is your Pure Gold Pure Enough? Part 2 of 2

August 25, 2016

The need to become REACH compliant created demand for an arsenic-free, lead-free pure gold electroplating solution. Part 2 of this series addresses available alternatives to standard products, allowing manufacturers to be REACH compliant with pure gold wirebonding.

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Dow’s Rozalia Beica to Present at the SEMICON Taiwan SiP Global Summit

August 23, 2016

Taipei will host SEMICON Taiwan and the SiP Global Summit.

The SiP Global Summit, which takes place during SEMICON Taiwan, is a two-day workshop devoted to advancements in system-in-package technologies. As part of this year’s novel material and equipment readiness segment of the program, Dow’s Rozalia Beica will tackle the challenges of both embedded technologies and fan-out wafer-level packaging.

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Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 1 of 2

August 17, 2016

CMP slurry, such as Dow’s OPTIPLANE™ slurry, is used to polish a wafer in chemical mechanical planarization.

In part one of this interview series, Dow's Adam Manzonie explains how the new OPTIPLANE™ CMP slurry platform meets requirements for 14nm node processes and below, which are much more sophisticated than those used for less advanced nodes. The OPTIPLANE™ CMP slurry family consists of Dow’s most advanced slurries for dielectric chemical mechanical planarization (CMP).

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Are you ahead of the curve for REACH compliance? Part 1 of 2

August 16, 2016

REACH compliance is impacting the chemical industry worldwide, impacting everyone from raw material producers and suppliers to OEMs. In this two-part series, we will share Dow’s specific strategies and examples to ensure products are REACH compliant. Part 1 looks at the REACH landscape and key considerations for suppliers.

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Inkjet Printing for Eco-friendly PCB Etch Processes

August 11, 2016

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PCBs are becoming more complex and with smaller tolerances and manufacturers keep pace by improving process capability. Drivers, especially price pressures, have driven improvements in efficiency and yield for etch processes. These same trends are driving interest in inkjet printing, which also offers a more environmentally friendly approach over traditional methods.

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Takeaways from Dow’s ECTC 2016 Presentation on Advancements in Low-Temp Bonding

August 04, 2016

Computer enhanced image of a part of a semiconductor wafer.

It was clear at ECTC 2016 that advanced packaging is the fastest-growing segment in semiconductor packaging. Dow Electronic Materials contributed to the conference by presenting our work on advancements in low-temperature bonding using electrodeposited indium. This post shares the content we presented at this year’s show.

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Investigating Organic Photovoltaic Cells for Renewable Energy Conversion

August 02, 2016

A young man using a tablet computer

Organic materials have significant potential for the next-generation of high-tech applications like solar cells, LEDs and displays. This paper explores our work with the University of Minnesota to improve understanding of how pure active materials must be to meet industry specifications and optimize device performance.

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Chemical Trimming Overcoat Enhances Multiple Pattern Lithography

July 29, 2016

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Extreme ultraviolet (EUV) technology is solidly positioned on the semiconductor manufacturing roadmap, but interim technologies are needed to extend 193nm immersion lithography until EUV enters production. Multiple patterning is one such technology, and this article discusses a novel spin-on chemical trim overcoat formulation that simplifies the advanced patterning process.

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Via Fill’s Role in the Evolution of Portable Electronics

July 21, 2016

Stack of cell phones

Cellphones have evolved considerably in the past 20 years, both in terms of form and function, as the market has exploded globally. Development of cellphone technology has been a major driver for advances in semiconductor packaging and printed circuit board (PCB) design, and via fill plays an important role.

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The State of EUV Lithography: A Materials Primer

July 19, 2016

Photo of James W. Thackeray, Ph.D.

Extreme ultraviolet (EUV) lithography is the most promising of the post-optical lithography patterning technologies to enable continued shrink, keeping the semiconductor industry on the path of Moore’s law. Dow’s two Litho University℠ video tutorials on EUV are a great place to start learning the fundamentals of EUV technology.

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