Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Tailoring Copper Plating for Vias on IC Package Substrates

November 28, 2017

CuplatingviasforICpackagesubstrates_v1

IC substrate manufacturers must innovate to be competitive in a landscape where feature dimensions continue to shrink. Copper plating chemistries optimized for IC substrates is one step manufacturers can take toward achieving their production goals.

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Dow and DuPont to Exhibit at Productronica

November 02, 2017

DowandDuPontShowcaseTechatProductronicaShow_v1

With the merger of Dow and DuPont freshly completed, this year’s Productronica show, taking place Nov. 14-17 in Munich, Germany, represents the first opportunity to meet with the companies post-merger. So, what will change moving forward?

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How Silver Catalysts Enhance PCB Manufacturing

October 31, 2017

silvercatalystsenhancePCBmanufacturingUsed in many applications, silver catalysts provide a balance of features: good catalytic activity, high electrical conductivity, modest cost, and good process stability. As such, they are increasingly being explored for use in PCB manufacturing.

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Nitta Haas Receives Siltronic's Long-Term Partner Award for Polishing Materials

October 30, 2017

Senior leaders from Siltronic AG present the Supplier of the Year award to representatives from Nitta Haas and Dow’s CMP Technologies business. One of the strongest endorsements of a company’s performance and product quality is through industry supplier awards. Dow is proud to announce that its joint venture Nitta Haas has received Siltronic's Long-Term Partner Award for polishing materials.

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Dow to Discuss Tin Whiskers and HDI Electroplating at 2017 IMPACT Conference

October 16, 2017

TinwhiskersandHDIelectroplatingarehottopicsforIMPACT2017Examining the “IMPACT on Intelligent Everything,” this year's IMPACT conference will feature papers from Dow on the latest technological advances for tin whiskers and HDI electroplating.

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Flexible PCBs for Smartphones Need New Metallization Processes

September 26, 2017

Although cell phones aren't flexible, they are increasingly utilizing flexible PCBs to fit all required components into small form factors.

Consumers are demanding ever-more functionality and battery life from their smartphones, which is driving a need for flexible PCBs (FPCBs). This article looks at design considerations of metallization processes for FPCBs, which will enable future devices.

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Press-Fit Solutions Address Future Automotive Reliability Requirements

September 06, 2017

Dow’s solderless press-fit solutions address next generation automotive reliability requirements.Automotive electronics have long had to meet demanding reliability standards. As a result, automotive PCBs, with millions of through holes, are migrating towards solderless press-fit interconnection solutions as an alternative to soldering.

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Innovation in CMP: The IKONIC™ Polishing Pad Platform

August 29, 2017

IKONIC™ CMP polishing pads

The IKONIC™ polishing pad platform has been Dow’s biggest CMP portfolio expansion in recent years, an innovation in advanced pad technology targeting multiple CMP applications. In this interview, Colin Cameron discusses the technology and its value in the marketplace.

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Dow Litho Technologies Recognized with SMIC’s Best Technical Supplier Award

August 02, 2017

Dow receives SMIC’s Best Technical Supplier Award.As a leading supplier of lithography consumables, customer satisfaction is a key performance metric. Dow’s Litho Technologies team is honored to be recognized with the Best Technical Supplier Award from SMIC, the largest semiconductor foundry in China.

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Advanced Via Fill for HDI Applications

August 01, 2017

Continuous innovation in advanced via fill will enable new HDI applications.The smart phone market is driving improved via fill for HDI substrates, but it will also be needed for several emerging electronics markets. Continuous innovation in copper via fill is needed to meet new requirements.

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