Dow Electronic Materials


Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Copper Pillar Electroplating Tutorial

December 08, 2016

This tutorial examines the requirements and processing considerations for electroplated copper pillars used in advanced chip packaging applications. The key aspects of the plating process and the role of each in achieving the desired design and performance goals are described.

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Performance Gains in CMP Slurry for Advanced Semiconductor Nodes

December 07, 2016


In a recent Solid State Technology article, Dow authors report on some of the complexities in chemical mechanical planarization (CMP) processes at advanced semiconductor nodes. Dow’s new OPTIPLANE™ slurry platform demonstrates excellent performance in meeting new process needs.

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Autonomous Cars Are Driving the Next Gen of PCB Material Requirements

November 23, 2016

Autonomous cars are driving automotive PCB material requirements

Cars increasingly rely on PCBs with chips that control everything from safety to passenger comfort and convenience. This is driving a need for highly reliable PCB materials that not only survive in a harsh environment, but also pass stringent thermal reliability tests that demonstrate long-term stability.

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Copper Electroplating Fundamentals

November 22, 2016

A short tutorial examining the fundamentals of copper plating

This tutorial examines the concept of copper electroplating and how the process works. It also discusses its use in advanced packaging applications like the dual damascene process, TSC, copper pillars, and copper RDL, as well as how feature geometry as well as plating time affect how additives behave.

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Evolution of LCDs, Part 1: BCS Technology

November 15, 2016

Evolution of LCDs, Part 1: BCS Technology

In this interview, Dow experts answer questions on the evolution of the LCD television market and how it is reshaping the future of displays. The interview then drills down into black column spacer (BCS) technology and its impact on cost and performance in the display market.

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Dow Presentations Provide Gold, Silver, and Copper Solutions for IoT Devices at IMPACT-IIAC 2016

November 09, 2016

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Dow was recently one of a few invited speakers outside academia to present at IMPACT-IIAC 2016. Aptly themed, “IMPACT on the Next Big Things,” the conference included panel sessions, industrial sessions and paper presentations on accelerating manufacturing and commercialization. Dow addressed four separate topics, all relating to gold, silver and copper solutions for IoT devices.

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Technology Spotlight: IKONIC™ 4100 Polishing Pads, R&D 100 Awards Finalist

November 01, 2016

Technology Spotlight: IKONIC™ 4100 Polishing Pads, Finalist for the R&D 100 Awards

The IKONIC™ 4100 CMP pad series is a finalist for the 2016 R&D 100 Awards. Hear from our in-house experts about this innovative technology and how it is used in advanced chemical mechanical planarization (CMP). This is part two in a series profiling the R&D 100 Award Finalists from Dow Electronic Materials.

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Technology Spotlight: CTO™ 2000 Trimming Overcoat Named an R&D 100 Finalist

October 27, 2016

CTO™ 2000 Trimming Overcoat Named an R&D 100 Finalist

The R&D 100 Awards are one of the highest honors in the research and design community. In this interview, we talk to Dow experts about the innovation behind one of this year’s finalists, CTO™ 2000 Trimming Overcoat, a solution for lithography in semiconductor manufacturing that enables patterning of smaller features than photolithography can do alone.

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The Present and Future of OLED Materials Development

October 13, 2016

The Present and Future of OLED Materials Development.

At the Global Materials Tech Fair in Seoul, Dow’s senior R&D manager Dai-Kyu Kim, recently delivered a lecture on the present and future of organic light emitting diode (OLED) materials development. Kim addressed the market outlook for OLEDs, including the evolution of OLED displays, and Dow’s contributions to the growth of the overall OLED display industry.

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Dow to Present on the Challenges for Materials at the 14th International System-on-Chip Conference

October 05, 2016

Dow to Present on the Challenges for Materials at the 14th International System-on-Chip Conference

At this year’s International System-on-Chip Conference, Dow Electronic Materials will present on the challenges facing SoC manufacturing from a chemistry perspective. Matthew Grandbois, Ph.D., will discuss how SoC devices have emerged to enable the continued evolution of electronic performance beyond what is achievable at 28nm, and Dow’s role in providing materials solutions for this challenging architectural landscape.

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