Dow Electronic Materials


Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Dow to Present at PRiME 2016: From TSV to Copper Pillars’ Transformative Technology

September 27, 2016


The Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) conference brings together leading industry players to discuss a diverse blend of electrochemical and solid-state science and technology. This year, Dow Electronic Materials will present on how TSV and copper pillars are transforming semiconductor advanced packaging technology.

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Peter Trefonas, 2016 Perkin Medal Recipient, Credits Chemistry for Enabling the Information Age

September 26, 2016

Peter Trefonas, Ph.D., received the Society of Chemical Industry (SCI) Perkin Medal on September 13, 2016, recognized as the highest honor given for outstanding work in applied chemistry in the United States. At the award ceremony, Trefonas spoke to how chemistry innovations enabled the Information Age.

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OLED Displays Change Future Display Paradigms

September 14, 2016

OLED Displays will change the future of display paradigms.

The market for OLED displays is growing at a rapid pace, driven by smartphones, TVs, wearable devices, and more. This is driving new technology requirements to keep up with market trends. Demand for materials required in panel production is expected to increase along with the overall market growth.

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Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 2 of 2

September 13, 2016

An engineer uses metrology tools to evaluate the performance of Dow’s CMP slurries in the lab.

Part two of this interview with Dow's Adam Manzonie examines Dow’s recently launched OPTIPLANE™ CMP slurry platform, focusing on the market drivers and steps to commercialization to deliver a total solution to meet 14nm chemical mechanical planarization (CMP) requirements.

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Dow’s Peter Trefonas, Ph.D., Interviewed at SPIE Advanced Lithography

September 06, 2016

Peter Trefonas, Ph.D., at SPIE Advanced Lithography

At the 2016 SPIE Advanced Lithography Conference, Peter Trefonas, Ph.D., was interviewed about his experiences in the field of photolithography. Throughout Trefonas’ 30+ years in the lithography field he has made significant contributions to photoresist technology and anti-reflective coatings.

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Dow's Michelle Ho, Ph.D., to Discuss CMP Slurry for TSV at SEMICON Taiwan

September 01, 2016


The complexity of through-silicon via (TSV) geometry has increased the difficulty of global uniformity after the chemical mechanical planarization (CMP) process. At SEMICON Taiwan, Dow’s Michelle Ho, Ph.D., will address this in a presentation, "Expandable and Tunable CMP Slurry Platform for TSV Applications," as part of the CMP Forum on September 7, 2016.

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Semiconductor Manufacturing Technologies from Dow Named Finalists for R&D 100 Awards

August 31, 2016

Dow’s CTO™ 2000 Trimming Overcoat and IKONIC™ 4100 Polishing Pads for semiconductor manufacturing have been named finalists for the 2016 R&D 100 Awards

Two Dow technologies used in the process of fabricating integrated circuits have been named finalists in R&D Magazine’s prestigious 2016 R&D 100 Awards. Our CTO™ 2000 Trimming Overcoat enhances the photolithography process while IKONIC™ 4100 Polishing Pads optimize performance for chemical mechanical planarization (CMP).

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Managing Material Properties of Fan-out Wafer-Level Packages

August 30, 2016

RDL Intervia

Advanced packages require specialty electronic materials to be made profitably and reliably. Fan-out wafer level packaging (FOWLP), has three key structures to consider: the dielectric layer, the redistribution layer (RDL), and Cu pillars. Part two of this two-part FOWLP series investigates these key structures and considerations for managing material properties.

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Becoming REACH Compliant: Is your Pure Gold Pure Enough? Part 2 of 2

August 25, 2016

The need to become REACH compliant created demand for an arsenic-free, lead-free pure gold electroplating solution. Part 2 of this series addresses available alternatives to standard products, allowing manufacturers to be REACH compliant with pure gold wirebonding.

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Dow’s Rozalia Beica to Present at the SEMICON Taiwan SiP Global Summit

August 23, 2016

Taipei will host SEMICON Taiwan and the SiP Global Summit.

The SiP Global Summit, which takes place during SEMICON Taiwan, is a two-day workshop devoted to advancements in system-in-package technologies. As part of this year’s novel material and equipment readiness segment of the program, Dow’s Rozalia Beica will tackle the challenges of both embedded technologies and fan-out wafer-level packaging.

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