Dow Electronic Materials


Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

The Present and Future of OLED Materials Development

October 13, 2016

The Present and Future of OLED Materials Development.

At the Global Materials Tech Fair in Seoul, Dow’s senior R&D manager Dai-Kyu Kim, recently delivered a lecture on the present and future of organic light emitting diode (OLED) materials development. Kim addressed the market outlook for OLEDs, including the evolution of OLED displays, and Dow’s contributions to the growth of the overall OLED display industry.

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Dow to Present on the Challenges for Materials at the 14th International System-on-Chip Conference

October 05, 2016

Dow to Present on the Challenges for Materials at the 14th International System-on-Chip Conference
At this year’s International System-on-Chip Conference, Dow Electronic Materials will present on the challenges facing SoC manufacturing from a chemistry perspective. Matthew Grandbois, Ph.D., will discuss how SoC devices have emerged to enable the continued evolution of electronic performance beyond what is achievable at 28nm, and Dow’s role in providing materials solutions for this challenging architectural landscape.

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CMP Solutions for 10nm and Beyond

October 04, 2016

A silicon wafer. At the 10 nanometer node and other future nodes, new CMP solutions will be needed to meet manufacturing requirements

As manufacturers plan for 10nm and future nodes, requirements for chemical mechanical planarization (CMP) defect levels become increasingly challenging. Due to the stringent CMP requirements for front-end planarization of finFET devices, new materials will be needed to achieve high planarization efficiency and low defect rates, ensuring reliable CMP for the next generation of finFET devices.

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Hear from Dow’s Experts at the ICPT CMP Conference in Beijing

October 03, 2016

ICPT 2016, China’s premier CMP conference, will take place in Beijing, China.
The International Conference on Planarization/CMP Technology (ICPT) will be held in Beijing, China, October 17-19, 2016. Dow Electronic Materials will be well-represented at this leading CMP conference with session topics on materials and metrology, as well as poster presentations dedicated to some of our newest CMP pad and slurry technology.

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Dow to Present at PRiME 2016: From TSV to Copper Pillars’ Transformative Technology

September 27, 2016


The Pacific Rim Meeting on Electrochemical and Solid-State Science (PRiME) conference brings together leading industry players to discuss a diverse blend of electrochemical and solid-state science and technology. This year, Dow Electronic Materials will present on how TSV and copper pillars are transforming semiconductor advanced packaging technology.

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Peter Trefonas, 2016 Perkin Medal Recipient, Credits Chemistry for Enabling the Information Age

September 26, 2016

Peter Trefonas, Ph.D., received the Society of Chemical Industry (SCI) Perkin Medal on September 13, 2016, recognized as the highest honor given for outstanding work in applied chemistry in the United States. At the award ceremony, Trefonas spoke to how chemistry innovations enabled the Information Age.

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OLED Displays Change Future Display Paradigms

September 14, 2016

OLED Displays will change the future of display paradigms.

The market for OLED displays is growing at a rapid pace, driven by smartphones, TVs, wearable devices, and more. This is driving new technology requirements to keep up with market trends. Demand for materials required in panel production is expected to increase along with the overall market growth.

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Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 2 of 2

September 13, 2016

An engineer uses metrology tools to evaluate the performance of Dow’s CMP slurries in the lab.

Part two of this interview with Dow's Adam Manzonie examines Dow’s recently launched OPTIPLANE™ CMP slurry platform, focusing on the market drivers and steps to commercialization to deliver a total solution to meet 14nm chemical mechanical planarization (CMP) requirements.

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Dow’s Peter Trefonas, Ph.D., Interviewed at SPIE Advanced Lithography

September 06, 2016

Peter Trefonas, Ph.D., at SPIE Advanced Lithography

At the 2016 SPIE Advanced Lithography Conference, Peter Trefonas, Ph.D., was interviewed about his experiences in the field of photolithography. Throughout Trefonas’ 30+ years in the lithography field he has made significant contributions to photoresist technology and anti-reflective coatings.

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Dow's Michelle Ho, Ph.D., to Discuss CMP Slurry for TSV at SEMICON Taiwan

September 01, 2016


The complexity of through-silicon via (TSV) geometry has increased the difficulty of global uniformity after the chemical mechanical planarization (CMP) process. At SEMICON Taiwan, Dow’s Michelle Ho, Ph.D., will address this in a presentation, "Expandable and Tunable CMP Slurry Platform for TSV Applications," as part of the CMP Forum on September 7, 2016.

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