Dow Electronic Materials


Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

James Thackeray Named SPIE Fellow

April 13, 2017

James Thackeray, Ph.D., new SPIE Fellow

Dr. Thackeray has been named a SPIE Fellow for his many achievements in lithography materials development over the past decade, many of which have contributed to enabling Moore’s law.

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Market Drivers for Advanced Packaging Metallization

April 04, 2017

Solder bumps used  in advanced packaging metallization.

Advanced wafer-level packaging technologies hold the key to meeting the future needs of electronic devices. This requires advances in electronic materials, and advanced metallization technologies are no exception.

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NPI Awards Honor COPPER GLEAM™ PPR-II Acid Cu Plating

March 22, 2017

The annual NPI Awards recognize best-of-breed new products. We're proud to announce that Dow’s COPPER GLEAM™ PPR-II Acid Cu was named best new plating technology for 2017.

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Advancing the Thick PCB Manufacturing Process for 5G Infrastructure

March 20, 2017

PCB Manufacturing Process for 5G Infrastructure

The demand for thick PCBs is increasing, presenting a challenge and an opportunity for copper plating. Here, we look at how Dow is advancing the thick PCB manufacturing process to support the growth of 5G infrastructure.

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Dow to Present on Acidic CMP Slurry and Advanced Patterning at CSTIC

March 10, 2017

Shanghai International Convention Center, home of the 2017 China Semiconductor Technology International Conference (CSTIC)

Dow will be at the China Semiconductor Technology International Conference with presentations on work from our CMP and lithography teams. One seminar will share findings on acidic ILD slurries, and the second will discuss lithographic materials when moving beyond 10nm.

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Moving into China: Advances in Next-Generation Displays

March 07, 2017

China is embracing next-generation display technologies

China’s display market is growing rapidly, and if SID hosting its first-ever conference there is any indication, it is well on its way. Kathleen O’Connell offers an overview of her plenary session, explaining how multiple display technologies have room to succeed.

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IMAPS Device Packaging Conference to Feature Next-Gen Materials and Trends

February 28, 2017

Dow to speak at IMAPS Device Packaging Conference

At this year’s IMAPS Device Packaging Conference, Dow experts will present sessions on Integrated Packaging and Substrate Technologies for Next-Generation Smart Devices, and Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Technologies.

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Dow Weighs in on the Heterogeneous Integration Roadmap for 2017

February 21, 2017

Dow's Kavanagh looks ahead at the heterogeneous integration roadmap in this 2017 outlook.

This year, industry publication 3D InCites asked companies to comment on the new initiative for a Heterogeneous Integration Technology Roadmap for Semiconductors. Dow’s Rob Kavanagh shares his opinion in his 2017 outlook.

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Advances in Patterning Materials and Processes at SPIE Advanced Lithography

February 20, 2017

SPIE Advanced Lithography takes place Feb. 26 to Mar. 2, 2017 in San Jose, California.

Dow experts will present at this year’s SPIE Advanced Lithography as part of Advances in Patterning Materials and Processes Conference. Preview our presentations on embedded topcoat for EUV and soft spacer materials for advanced hole patterning.

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2017 Outlook: Semiconductor Market Forecast Calls for Continued Collaboration

February 16, 2017

Business executives collaborate on a project in a conference room. This year’s semiconductor market forecast calls for continued industry collaboration.
The semiconductor market forecast is strong for 2017. Dow's Colin Cameron discusses market drivers and the value of continued collaboration in an editorial for Solid State Technology.

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