Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Press-Fit Solutions Address Future Automotive Reliability Requirements

September 06, 2017

Dow’s solderless press-fit solutions address next generation automotive reliability requirements.Automotive electronics have long had to meet demanding reliability standards. As a result, automotive PCBs, with millions of through holes, are migrating towards solderless press-fit interconnection solutions as an alternative to soldering.

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Innovation in CMP: The IKONIC™ Polishing Pad Platform

August 29, 2017

IKONIC™ CMP polishing pads

The IKONIC™ polishing pad platform has been Dow’s biggest CMP portfolio expansion in recent years, an innovation in advanced pad technology targeting multiple CMP applications. In this interview, Colin Cameron discusses the technology and its value in the marketplace.

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Dow Litho Technologies Recognized with SMIC’s Best Technical Supplier Award

August 02, 2017

Dow receives SMIC’s Best Technical Supplier Award.As a leading supplier of lithography consumables, customer satisfaction is a key performance metric. Dow’s Litho Technologies team is honored to be recognized with the Best Technical Supplier Award from SMIC, the largest semiconductor foundry in China.

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Advanced Via Fill for HDI Applications

August 01, 2017

Continuous innovation in advanced via fill will enable new HDI applications.The smart phone market is driving improved via fill for HDI substrates, but it will also be needed for several emerging electronics markets. Continuous innovation in copper via fill is needed to meet new requirements.

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The Future Is Cadmium-Free – Bright and Safe!

July 27, 2017

LEDScreenQuantumDotsA key trend in electronics manufacturing is reducing the use of potentially harmful materials, such as cadmium. As a result, major global display manufacturers are moving away from cadmium-based QDs and committing to adopt cadmium-free QDs technology.

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Inkjet Masking Reduces Gold Usage (and Cost) in Connectors

July 19, 2017

Inkjet masking reduces gold usage and cost in connectors. 

In the electrical connector industry, gold is frequently used because of its conductivity. Given its cost, there is a strong manufacturing need for a more effective masking procedure that can be carried out rapidly and offers improved resolution in reel-to-reel production.

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Fine-tuning CMP Slurries for 3D TSV Processes

June 27, 2017

enlongated_particles

Chemical mechanical planarization (CMP) is a critical element of the 3D through silicon via (TSV) process flow for controlling wafer topography. Here, Dow’s Michelle Ho explains the role of CMP in TSV processes and discusses CMP slurry design for 3D TSVs.

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Dow Electronic Materials’ James T. Fahey to Keynote Inaugural IMAPS SiP 2017 Conference

June 21, 2017

Dow Electronic Materials’ James T. Fahey, Ph.D. will offer a keynote at the inaugural IMAPS SiP 2017 Conference

Dow’s James T. Fahey, Ph.D. will offer the afternoon keynote titled “The Evolution of Electronic Materials and the Information Age,” during the first-ever IMAPS System-in-Package conference. He will examine the semiconductor industry’s evolution and role of electronic materials.

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Developing the Chinese Semiconductor Industry Ecosystem

May 25, 2017

Two people inspect a flexible electronic circuit board at a facility in South China that is part of the growing China semiconductor ecosystem.

With rapid growth occurring in the Chinese semiconductor industry, George Lu posits that the country needs to build out a complete supply chain to compete globally for advanced node manufacturing.

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How Indium Enables Advanced Semiconductor Packaging

May 25, 2017

Indium offers an option for low-temp semiconductor advanced packaging applications.

For a group of emerging electronics applications, high-temperature manufacturing processes pose significant challenges. In this interview, Dow’s experts explain the drivers for its latest SOLDERON plating chemistry leveraging the material properties of indium.

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