Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Showing all articles related to Chemical mechanical planarization

Display Technologies Specialty Silicones Team Shares Solutions at Guangzhou International Lighting Exhibition

August 09, 2018

The Guangzhou International Lighting Exhibition (GILE) is one of the world’s foremost lighting shows, attracting world-leading companies such as Dow.At the 2018 Guangzhou International Lighting Exhibition, Dow Display Technologies Specialty Silicones Team exhibited solutions for chip-scale packaging.

Read More

2018 Semiconductor Industry Outlook: Riding a Growth Trend

March 13, 2018

A businessman sits in a chair contemplating the semiconductor industry outlook.Dow’s Adam Manzonie gives his insight on what may extend the semiconductor industry’s growth in 2018. Overall product quality from material suppliers is key in 2018 to meet ever more stringent process control requirements.

Read More

Innovation in CMP: The IKONIC™ Polishing Pad Platform

August 29, 2017

IKONIC™ CMP polishing pads

The IKONIC™ polishing pad platform has been Dow’s biggest CMP portfolio expansion in recent years, an innovation in advanced pad technology targeting multiple CMP applications. In this interview, Colin Cameron discusses the technology and its value in the marketplace.

Read More

2017 Outlook: Semiconductor Market Forecast Calls for Continued Collaboration

February 16, 2017

Business executives collaborate on a project in a conference room. This year’s semiconductor market forecast calls for continued industry collaboration.
The semiconductor market forecast is strong for 2017. Dow's Colin Cameron discusses market drivers and the value of continued collaboration in an editorial for Solid State Technology.

Read More

Performance Gains in CMP Slurry for Advanced Semiconductor Nodes

December 07, 2016

Scientist

In a recent Solid State Technology article, Dow authors report on some of the complexities in chemical mechanical planarization (CMP) processes at advanced semiconductor nodes. Dow’s new OPTIPLANE™ slurry platform demonstrates excellent performance in meeting new process needs.

Read More

Technology Spotlight: IKONIC™ 4100 Polishing Pads, R&D 100 Awards Finalist

November 01, 2016

Technology Spotlight: IKONIC™ 4100 Polishing Pads, Finalist for the R&D 100 Awards

The IKONIC™ 4100 CMP pad series is a finalist for the 2016 R&D 100 Awards. Hear from our in-house experts about this innovative technology and how it is used in advanced chemical mechanical planarization (CMP). This is part two in a series profiling the R&D 100 Award Finalists from Dow Electronic Materials.

Read More

Hear from Dow’s Experts at the ICPT CMP Conference in Beijing

October 03, 2016

ICPT 2016, China’s premier CMP conference, will take place in Beijing, China.

The International Conference on Planarization/CMP Technology (ICPT) will be held in Beijing, China, October 17-19, 2016. Dow Electronic Materials will be well-represented at this leading CMP conference with session topics on materials and metrology, as well as poster presentations dedicated to some of our newest CMP pad and slurry technology.

Read More

Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 2 of 2

September 13, 2016

An engineer uses metrology tools to evaluate the performance of Dow’s CMP slurries in the lab.

Part two of this interview with Dow's Adam Manzonie examines Dow’s recently launched OPTIPLANE™ CMP slurry platform, focusing on the market drivers and steps to commercialization to deliver a total solution to meet 14nm chemical mechanical planarization (CMP) requirements.

Read More

Dow's Michelle Ho, Ph.D., to Discuss CMP Slurry for TSV at SEMICON Taiwan

September 01, 2016

2016_0901_SemiconTaiwan_small

The complexity of through-silicon via (TSV) geometry has increased the difficulty of global uniformity after the chemical mechanical planarization (CMP) process. At SEMICON Taiwan, Dow’s Michelle Ho, Ph.D., will address this in a presentation, "Expandable and Tunable CMP Slurry Platform for TSV Applications," as part of the CMP Forum on September 7, 2016.

Read More

Semiconductor Manufacturing Technologies from Dow Named Finalists for R&D 100 Awards

August 31, 2016

Dow’s CTO™ 2000 Trimming Overcoat and IKONIC™ 4100 Polishing Pads for semiconductor manufacturing have been named finalists for the 2016 R&D 100 Awards

Two Dow technologies used in the process of fabricating integrated circuits have been named finalists in R&D Magazine’s prestigious 2016 R&D 100 Awards. Our CTO™ 2000 Trimming Overcoat enhances the photolithography process while IKONIC™ 4100 Polishing Pads optimize performance for chemical mechanical planarization (CMP).

Read More