Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

SPN Viewpoint 2018: The Fan-Out Conversation and Memory Growth Continue

February 15, 2018

Teardown of a modern mobile device highlights a number of relevant 2018 advanced packaging trends.In this look ahead to 2018, Rob Kavanagh discusses advanced packaging trends for 2018. With the memory market is on the rise, advanced packaging suppliers will be faced with more challenges.

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Dow Prepares for the 2018 SPIE Advanced Lithography Conference

January 29, 2018

A packed suitcase in front of a plane. The Dow Lithography team is packing their bags for the 2018 SPIE Advanced Lithography conference.The SPIE Advanced Lithography conference is known for leading-edge technical research. In 2018, Dow will present on: improving performance through LWR analysis; the trade-offs of shot noise, LER and RLS; and innovative SiARC materials for implant lithography.

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Dow and DuPont Previewed Future Display Technologies at IMID 2017

December 11, 2017

IMIDbooth1017_v1The possibilities for future display technologies are seemingly endless, from OLED to flexible to quantum dot. Together Dow and DuPont recently showcased how they are advancing high performance displays with the latest materials innovations.

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Dow and DuPont to Exhibit at Productronica

November 02, 2017

DowandDuPontShowcaseTechatProductronicaShow_v1

With the merger of Dow and DuPont freshly completed, this year’s Productronica show, taking place Nov. 14-17 in Munich, Germany, represents the first opportunity to meet with the companies post-merger. So, what will change moving forward?

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Nitta Haas Receives Siltronic's Long-Term Partner Award for Polishing Materials

October 30, 2017

Senior leaders from Siltronic AG present the Supplier of the Year award to representatives from Nitta Haas and Dow’s CMP Technologies business. One of the strongest endorsements of a company’s performance and product quality is through industry supplier awards. Dow is proud to announce that its joint venture Nitta Haas has received Siltronic's Long-Term Partner Award for polishing materials.

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Dow to Discuss Tin Whiskers and HDI Electroplating at 2017 IMPACT Conference

October 16, 2017

TinwhiskersandHDIelectroplatingarehottopicsforIMPACT2017Examining the “IMPACT on Intelligent Everything,” this year's IMPACT conference will feature papers from Dow on the latest technological advances for tin whiskers and HDI electroplating.

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Dow Litho Technologies Recognized with SMIC’s Best Technical Supplier Award

August 02, 2017

Dow receives SMIC’s Best Technical Supplier Award.As a leading supplier of lithography consumables, customer satisfaction is a key performance metric. Dow’s Litho Technologies team is honored to be recognized with the Best Technical Supplier Award from SMIC, the largest semiconductor foundry in China.

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Dow Electronic Materials’ James T. Fahey to Keynote Inaugural IMAPS SiP 2017 Conference

June 21, 2017

Dow Electronic Materials’ James T. Fahey, Ph.D. will offer a keynote at the inaugural IMAPS SiP 2017 Conference

Dow’s James T. Fahey, Ph.D. will offer the afternoon keynote titled “The Evolution of Electronic Materials and the Information Age,” during the first-ever IMAPS System-in-Package conference. He will examine the semiconductor industry’s evolution and role of electronic materials.

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Dow to Showcase New Metallization Chemistries at ECTC 2017

May 19, 2017

Dow showcasing its metallization and other advanced packaging technologies at ECTC 2016.

Dow is a proud sponsor of ECTC 2017. At this year’s show, we will introduce SOLDERON™ BP Indium 1000 and INTERVIA™ 9000 Cu products. Learn how these new products expand our metallization portfolio for emerging advanced packaging applications.

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James Thackeray Named SPIE Fellow

April 13, 2017

James Thackeray, Ph.D., new SPIE Fellow

Dr. Thackeray has been named a SPIE Fellow for his many achievements in lithography materials development over the past decade, many of which have contributed to enabling Moore’s law.

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