Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

ECTC 2018 Forges New Frontiers for Heterogeneous Integration

May 22, 2018

Silhouetted woman with data streams represents human-to-machine interface, symbolizing Dow’s papers at ECTC 2018Dow Electronic Materials will be out in force at ECTC 2018 with our advanced electronics packaging experts and technology featured in multiple technical presentations covering fan-out wafer-level Packaging and more.

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Dow Expert Presents Innovative CSP LED Material Solution to Epistar

May 20, 2018

Representatives from Dow Electronic Materials accept the Certificate of Appreciation from Epistar for work on CSP LED materialsLeveraging Dow’s expertise in LED materials, Epistar has partnered with us to extend its LED package manufacturing business to integrate chip-scale packages (CSPs) LED packaging. This partnership will present new solutions for LEDs and beyond.

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Rozalia Beica To Provide the Material Supplier Perspective at ConFab 2018

May 17, 2018

A row of microphones evokes the speakers of the Heterogeneous Integration Panel at ConFab 2018.Leading industry expert on semiconductor advanced packaging, Rozalia Beica, will represent industry suppliers in the ConFab 2018 Panel on Heterogeneous Integration on May 22. The ConFab program discusses the latest trends in semiconductor device manufacturing.

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Dow’s Asia CMP Center Celebrates Phase 4 Grand Opening

April 19, 2018

Cliff Chen welcomes guests to Dow’s Asia CMP Center Phase 4 Grand OpeningDow Electronic Materials is expanding manufacturing operations for the production of pads for chemical mechanical planarization (CMP). Read on to see photos from the grand opening ceremony.

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MICROFILL™ SFP Acid Copper Earns Dow its Ninth NPI Award in 10 Years

April 09, 2018

Photo of Dow’s 9th PCD&F Award honoring Microfill SFP Acid Copper.Industry awards are one of the strongest endorsements of a company’s products, especially when judged by peers. Dow is honored to receive it’s ninth PCD&F NPI Award this year for MICROFILL™ SFP Acid Copper.

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Dow Litho and CMP Experts to Present Research at SEMICON China’s CSTIC

March 09, 2018

A view of the Shanghai International Convention Center, host of CSTIC 2018During the China Semiconductor Technology International Conference (CSTIC), representatives from Dow will share research on two topics: patterning materials for advanced 193nm immersion lithography, and the relationship between pad and slurry in CMP process optimization.

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Dow’s Peter Trefonas Named SPIE Fellow

February 26, 2018

TrefonasThumbnailDow’s Peter Trefonas has been named a Fellow of SPIE, the international society for optics and photonics. Trefonas has been recognized for his achievements in design for manufacturing and compact modeling.

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IMAPS DPC 2018 to Explore the Future of Advanced Packaging

February 26, 2018

The future of advanced packagingIMAPS Device Packaging Conference is always at the forefront of semiconductor advanced packaging, and this year, it will look into the future. Check out Dow presentations from Dow experts during this year’s event.

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SPN Viewpoint 2018: The Fan-Out Conversation and Memory Growth Continue

February 15, 2018

Teardown of a modern mobile device highlights a number of relevant 2018 advanced packaging trends.In this look ahead to 2018, Rob Kavanagh discusses advanced packaging trends for 2018. With the memory market is on the rise, advanced packaging suppliers will be faced with more challenges.

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Dow Prepares for the 2018 SPIE Advanced Lithography Conference

January 29, 2018

A packed suitcase in front of a plane. The Dow Lithography team is packing their bags for the 2018 SPIE Advanced Lithography conference.The SPIE Advanced Lithography conference is known for leading-edge technical research. In 2018, Dow will present on: improving performance through LWR analysis; the trade-offs of shot noise, LER and RLS; and innovative SiARC materials for implant lithography.

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