Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Dow and DuPont to Exhibit at Productronica

November 02, 2017

DowandDuPontShowcaseTechatProductronicaShow_v1

With the merger of Dow and DuPont freshly completed, this year’s Productronica show, taking place Nov. 14-17 in Munich, Germany, represents the first opportunity to meet with the companies post-merger. So, what will change moving forward?

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Nitta Haas Receives Siltronic's Long-Term Partner Award for Polishing Materials

October 30, 2017

Senior leaders from Siltronic AG present the Supplier of the Year award to representatives from Nitta Haas and Dow’s CMP Technologies business. One of the strongest endorsements of a company’s performance and product quality is through industry supplier awards. Dow is proud to announce that its joint venture Nitta Haas has received Siltronic's Long-Term Partner Award for polishing materials.

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Dow to Discuss Tin Whiskers and HDI Electroplating at 2017 IMPACT Conference

October 16, 2017

TinwhiskersandHDIelectroplatingarehottopicsforIMPACT2017Examining the “IMPACT on Intelligent Everything,” this year's IMPACT conference will feature papers from Dow on the latest technological advances for tin whiskers and HDI electroplating.

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Dow Litho Technologies Recognized with SMIC’s Best Technical Supplier Award

August 02, 2017

Dow receives SMIC’s Best Technical Supplier Award.As a leading supplier of lithography consumables, customer satisfaction is a key performance metric. Dow’s Litho Technologies team is honored to be recognized with the Best Technical Supplier Award from SMIC, the largest semiconductor foundry in China.

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Dow Electronic Materials’ James T. Fahey to Keynote Inaugural IMAPS SiP 2017 Conference

June 21, 2017

Dow Electronic Materials’ James T. Fahey, Ph.D. will offer a keynote at the inaugural IMAPS SiP 2017 Conference

Dow’s James T. Fahey, Ph.D. will offer the afternoon keynote titled “The Evolution of Electronic Materials and the Information Age,” during the first-ever IMAPS System-in-Package conference. He will examine the semiconductor industry’s evolution and role of electronic materials.

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Dow to Showcase New Metallization Chemistries at ECTC 2017

May 19, 2017

Dow showcasing its metallization and other advanced packaging technologies at ECTC 2016.

Dow is a proud sponsor of ECTC 2017. At this year’s show, we will introduce SOLDERON™ BP Indium 1000 and INTERVIA™ 9000 Cu products. Learn how these new products expand our metallization portfolio for emerging advanced packaging applications.

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James Thackeray Named SPIE Fellow

April 13, 2017

James Thackeray, Ph.D., new SPIE Fellow

Dr. Thackeray has been named a SPIE Fellow for his many achievements in lithography materials development over the past decade, many of which have contributed to enabling Moore’s law.

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NPI Awards Honor COPPER GLEAM™ PPR-II Acid Cu Plating

March 22, 2017

The annual NPI Awards recognize best-of-breed new products. We're proud to announce that Dow’s COPPER GLEAM™ PPR-II Acid Cu was named best new plating technology for 2017.

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Dow to Present on Acidic CMP Slurry and Advanced Patterning at CSTIC

March 10, 2017

Shanghai International Convention Center, home of the 2017 China Semiconductor Technology International Conference (CSTIC)

Dow will be at the China Semiconductor Technology International Conference with presentations on work from our CMP and lithography teams. One seminar will share findings on acidic ILD slurries, and the second will discuss lithographic materials when moving beyond 10nm.

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IMAPS Device Packaging Conference to Feature Next-Gen Materials and Trends

February 28, 2017

Dow to speak at IMAPS Device Packaging Conference

At this year’s IMAPS Device Packaging Conference, Dow experts will present sessions on Integrated Packaging and Substrate Technologies for Next-Generation Smart Devices, and Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Technologies.

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