Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Dow Electronic Materials’ James T. Fahey to Keynote Inaugural IMAPS SiP 2017 Conference

June 21, 2017

Dow Electronic Materials’ James T. Fahey, Ph.D. will offer a keynote at the inaugural IMAPS SiP 2017 Conference

Dow’s James T. Fahey, Ph.D. will offer the afternoon keynote titled “The Evolution of Electronic Materials and the Information Age,” during the first-ever IMAPS System-in-Package conference. He will examine the semiconductor industry’s evolution and role of electronic materials.

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Dow to Showcase New Metallization Chemistries at ECTC 2017

May 19, 2017

Dow showcasing its metallization and other advanced packaging technologies at ECTC 2016.

Dow is a proud sponsor of ECTC 2017. At this year’s show, we will introduce SOLDERON™ BP Indium 1000 and INTERVIA™ 9000 Cu products. Learn how these new products expand our metallization portfolio for emerging advanced packaging applications.

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James Thackeray Named SPIE Fellow

April 13, 2017

James Thackeray, Ph.D., new SPIE Fellow

Dr. Thackeray has been named a SPIE Fellow for his many achievements in lithography materials development over the past decade, many of which have contributed to enabling Moore’s law.

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NPI Awards Honor COPPER GLEAM™ PPR-II Acid Cu Plating

March 22, 2017

The annual NPI Awards recognize best-of-breed new products. We're proud to announce that Dow’s COPPER GLEAM™ PPR-II Acid Cu was named best new plating technology for 2017.

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Dow to Present on Acidic CMP Slurry and Advanced Patterning at CSTIC

March 10, 2017

Shanghai International Convention Center, home of the 2017 China Semiconductor Technology International Conference (CSTIC)

Dow will be at the China Semiconductor Technology International Conference with presentations on work from our CMP and lithography teams. One seminar will share findings on acidic ILD slurries, and the second will discuss lithographic materials when moving beyond 10nm.

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IMAPS Device Packaging Conference to Feature Next-Gen Materials and Trends

February 28, 2017

Dow to speak at IMAPS Device Packaging Conference

At this year’s IMAPS Device Packaging Conference, Dow experts will present sessions on Integrated Packaging and Substrate Technologies for Next-Generation Smart Devices, and Integration of Chemically Amplified Photoresist and High-Speed Copper Plating Products for Advanced Packaging Technologies.

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Dow Weighs in on the Heterogeneous Integration Roadmap for 2017

February 21, 2017

Dow's Kavanagh looks ahead at the heterogeneous integration roadmap in this 2017 outlook.

This year, industry publication 3D InCites asked companies to comment on the new initiative for a Heterogeneous Integration Technology Roadmap for Semiconductors. Dow’s Rob Kavanagh shares his opinion in his 2017 outlook.

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Advances in Patterning Materials and Processes at SPIE Advanced Lithography

February 20, 2017

SPIE Advanced Lithography takes place Feb. 26 to Mar. 2, 2017 in San Jose, California.

Dow experts will present at this year’s SPIE Advanced Lithography as part of Advances in Patterning Materials and Processes Conference. Preview our presentations on embedded topcoat for EUV and soft spacer materials for advanced hole patterning.

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Dow to Present at Inaugural Electron Devices Technology and Manufacturing Conference

February 09, 2017

The Electron Devices Technology Manufacturing Conference will take place for the first time in 2017.

The Electron Devices Technology Manufacturing Conference came about from the industry’s increased interest in how system integration improves device performance. This year, Dow offers its take on advanced materials and interconnect technologies for next-gen smart devices.

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Dow to Present on Packaging for Smart Devices at European 3D Summit

January 19, 2017

Dow to Present on Packaging for Smart Devices at European 3D Summit

At the European 3D Summit, Dow Electronic Materials’ Rozalia Beica takes a deeper look at global trends driving advanced packaging, highlighting applications, today’s technologies and future trends.

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