Dow Electronic Materials


Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Innovation in CMP: The IKONIC™ Polishing Pad Platform

August 29, 2017

IKONIC™ CMP polishing pads

The IKONIC™ polishing pad platform has been Dow’s biggest CMP portfolio expansion in recent years, an innovation in advanced pad technology targeting multiple CMP applications. In this interview, Colin Cameron discusses the technology and its value in the marketplace.

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How Indium Enables Advanced Semiconductor Packaging

May 25, 2017

Indium offers an option for low-temp semiconductor advanced packaging applications.

For a group of emerging electronics applications, high-temperature manufacturing processes pose significant challenges. In this interview, Dow’s experts explain the drivers for its latest SOLDERON plating chemistry leveraging the material properties of indium.

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Evolution of LCDs, Part 1: BCS Technology

November 15, 2016

Evolution of LCDs, Part 1: BCS Technology

In this interview, Dow experts answer questions on the evolution of the LCD television market and how it is reshaping the future of displays. The interview then drills down into black column spacer (BCS) technology and its impact on cost and performance in the display market.

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Technology Spotlight: IKONIC™ 4100 Polishing Pads, R&D 100 Awards Finalist

November 01, 2016

Technology Spotlight: IKONIC™ 4100 Polishing Pads, Finalist for the R&D 100 Awards

The IKONIC™ 4100 CMP pad series is a finalist for the 2016 R&D 100 Awards. Hear from our in-house experts about this innovative technology and how it is used in advanced chemical mechanical planarization (CMP). This is part two in a series profiling the R&D 100 Award Finalists from Dow Electronic Materials.

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Technology Spotlight: CTO™ 2000 Trimming Overcoat Named an R&D 100 Finalist

October 27, 2016

CTO™ 2000 Trimming Overcoat Named an R&D 100 Finalist

The R&D 100 Awards are one of the highest honors in the research and design community. In this interview, we talk to Dow experts about the innovation behind one of this year’s finalists, CTO™ 2000 Trimming Overcoat, a solution for lithography in semiconductor manufacturing that enables patterning of smaller features than photolithography can do alone.

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OLED Displays Change Future Display Paradigms

September 14, 2016

OLED Displays will change the future of display paradigms.

The market for OLED displays is growing at a rapid pace, driven by smartphones, TVs, wearable devices, and more. This is driving new technology requirements to keep up with market trends. Demand for materials required in panel production is expected to increase along with the overall market growth.

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Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 2 of 2

September 13, 2016

An engineer uses metrology tools to evaluate the performance of Dow’s CMP slurries in the lab.

Part two of this interview with Dow's Adam Manzonie examines Dow’s recently launched OPTIPLANE™ CMP slurry platform, focusing on the market drivers and steps to commercialization to deliver a total solution to meet 14nm chemical mechanical planarization (CMP) requirements.

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Dow’s Peter Trefonas, Ph.D., Interviewed at SPIE Advanced Lithography

September 06, 2016

Peter Trefonas, Ph.D., at SPIE Advanced Lithography

At the 2016 SPIE Advanced Lithography Conference, Peter Trefonas, Ph.D., was interviewed about his experiences in the field of photolithography. Throughout Trefonas’ 30+ years in the lithography field he has made significant contributions to photoresist technology and anti-reflective coatings.

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Addressing CMP Slurry Market Drivers with the OPTIPLANE™ Platform, Part 1 of 2

August 17, 2016

CMP slurry, such as Dow’s OPTIPLANE™ slurry, is used to polish a wafer in chemical mechanical planarization.

In part one of this interview series, Dow's Adam Manzonie explains how the new OPTIPLANE™ CMP slurry platform meets requirements for 14nm node processes and below, which are much more sophisticated than those used for less advanced nodes. The OPTIPLANE™ CMP slurry family consists of Dow’s most advanced slurries for dielectric chemical mechanical planarization (CMP).

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Dow’s Phillip Hustad, Ph.D., Featured in American Chemical Society “What Chemists Do” Series

June 14, 2016

Phillip Hustad, Ph.D., in the American Chemical Society’s video series 'What Chemists Do.'

Dow's Phillip Hustad, Ph.D., discusses his chemistry career in this video from the American Chemical Society's "What Chemists Do" video series. Watch the video to hear highlights from throughout his career including his graduate studies, his work synthesizing polyethylene at the industrial level, and advice for those getting started in the field.

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