A developable bottom anti-reflectant coating (DBARC) is an organic liquid used to control the reflectivity of the underlying substrate during the photolithography processes. Because DBARC develops alongside the photoresist, the surface is left ready for implantation or pattern transfer without requiring open etch. This makes it a viable alternative to BARC in today’s semiconductor manufacturing advanced patterning applications, as the relentless pursuit of Moore’s law has stretched lithography to its very limits in the attempt to scale to smaller nodes.
In this new video, Jim Cameron, Ph.D., provides an overview of DBARC and its application for advanced semiconductor lithography processes. First, he reviews DBARC material design principles. Next, he compares DBARC with conventional BARC, and explains how DBARC offers similar substrate reflectivity control without needing the BARC open-etch step. Lastly, he explains how these attributes make DBARC attractive for implant lithography, where reflectivity control on etch-sensitive substrates is required.
For further reading on DBARC and BARC technology, we recommend the following white papers:
For more background information, please also view An Introduction to Bottom Anti-Reflection Coating (BARC) Technology, a video by Jim Thackeray, Ph.D.