Dow is pleased to announce that Peter Trefonas, Ph.D., corporate fellow in Dow Electronic Materials, has been named a Fellow of SPIE, the international society for optics and photonics.
Each year, SPIE accepts nominations from among its membership for promotion as new Fellows of the Society. Fellows are selected based on their technical achievements in the areas of optics, photonics and imaging; as well as their contributions to the optical community and their involvement in SPIE.
Trefonas has been recognized for his work in design for manufacturing and compact modeling. Trefonas is a well-known industry leader in advanced lithographic technology, helping to develop photoresists and other materials that have facilitated production of smaller feature sizes in semiconductor manufacturing. His body of published work covers diverse topics including resist chemical mechanisms, percolation and reactive diffusion mechanisms, shot noise and stochastic effects, fractal analysis of development, and extreme ultraviolet (EUV) stochastics and stochastic development model.
“Being a named a Fellow of SPIE is a great honor and a real highlight of my career,” said Trefonas. “I am proud to join my colleague Jim Thackeray as the second representative from Dow to be promoted as a Fellow of the Society.”
Trefonas is co-author of an invited paper for this year’s Extreme Ultraviolet (EUV) Lithography conference at SPIE Advanced Lithography. You can read about the presentation—Shot Noise, LER and the RLS Trade-off: A Retrospective—and others from Dow in a recent Connectivity post.
To learn more about Trefonas’ published work, recognitions and contributions to the global optics community, read the SPIE press release.