On March 26, 2018, Dow Electronic Materials held a ribbon-cutting ceremony for its phase four (P4) expansion at its Asia CMP Manufacturing and Technical Center in Hsinchu, Taiwan. The facility’s addition will expand manufacturing operations for the production of pads for chemical mechanical planarization (CMP).
The business hosted many distinguished guests for the grand opening event. After an opening show, speeches were given by Dr. Liang-Gee Chen, Minister of the Ministry of Science and Technology; Kuei Ju Deng, Deputy Executive of Miaoli County Government; and Mario Stanghellini, Vice President and Global Business Director, Semiconductor Technologies, Dow Electronic Materials.
Cliff Chen, Hsinchu Site Leader, welcomes the crowd to the Phase 4 Grand Opening ceremony, introducing members of the team and guests who will participate in the ribbon-cutting.
Dr. Liang-Gee Chen, Minister of the Ministry of Science and Technology, was one of the distinguished guests who joined the Phase 4 Grand Opening and spoke during the ceremony.
Mario Stanghellini, Vice President and Global Business Director for Semiconductor Technologies, speaks to guests about the significance of the Asia CMP Center for the Electronics & Imaging business.
"Our customers have long relied on our ability to scale our operations to supply materials as they experience periods of growth, and this expansion is a great example of how we are continually taking steps forward to support them," said Mario Stanghellini, Vice President and Global Business Director, Semiconductor Technologies, Dow Electronic Materials. "Investing further here at our Asia CMP Center helps us to meet customer needs into the future by leveraging the strong infrastructure and talented team we have here in Taiwan."
After the opening speeches, a group of Dow and DuPont representatives, valued customers and Taiwan government officials participated in a ribbon-cutting ceremony. Next on the program was a lucky-knocking ceremony as the lion dancers led guests into the new P4 building. All guests were invited to join a site tour, followed by a brief program and lunch inside the P4 building.
The ribbon-cutting marked the official opening of the Phase 4 building. Representatives from Dow and DuPont, customers and the Taiwan government participated in the ribbon-cutting.
Lion dancers lead Scott Chang (left), Production and Maintenance Leader, CMP Technologies, and Chris Wang (right), P4 Project Manager, CMP Technologies, to be the first to enter the Phase 4 building after the ribbon was cut.
During the lunch program, Dr. James Fahey, Business President for Electronics & Imaging, spoke about the new Electronics & Imaging business that has been formed by bringing Dow Electronic Materials together with DuPont Electronics & Communications. Afterward, Dennis Chen, South Asia Business Director for CMP Technologies, spoke about the growth journey of the CMP Technologies business and the Asia CMP Manufacturing and Technical Center.
Pictured from left to right: Christine Tang, Administrative Specialist, Dow Electronic Materials; Robert Auger, Slurry R&D Director, Dow Electronic Materials; Chi Yen, Cleans Solutions Technology Director, DuPont EKC Technology, and Cliff Chen, Hsinchu Site Leader, Dow Electronic Materials, were among those who joined in the Grand Opening Ceremony.
The Asia CMP Center has been an important part of Dow Electronic Materials' growth. Its CMP manufacturing operations first began in the U.S., and later expanded into Japan through its joint venture, Nitta Haas Inc. In 2006, Dow Electronic Materials' Asia CMP Manufacturing and Technical Center first opened its doors at the Hsinchu Science Park's Jhunan campus, to better serve customers throughout the Asia-Pacific region. Later expansions to the Asia CMP Center added a CMP applications facility, research and development for pads and slurry, and new manufacturing capabilities.
For more information about the expansion,
read our press release (also available in Chinese).
The Phase 4 building (center) is the biggest expansion to the Asia CMP Center since its initial opening in 2006. The new building adds manufacturing capacity for CMP pads as well as new capabilities.