Chip-scale packages (CSP) for light emitting diodes (LEDs) are being pursued by LED manufacturers because they offer improved performance at a reduced total cost-of-ownership in comparison with standard LED packages. Because of CSP’s reduced footprint, temperature and light intensity increase significantly, which in turn requires robust silicone-based materials that won’t fail in harsh conditions. Such materials will ensure LEDs can achieve extended life spans. Because of Dow’s expertise in this space, Epistar Corp. partnered with us to extend its LED package manufacturing business to include CSP LEDs.
Recently, Takashi Sagawa, Japan R&D manager of Dow’s Electronics & Imaging’s Silicone business, was invited to present Dow’s roadmap for material solutions targeting CSP LEDs at Epistar’s headquarters in Hsinchu, Taiwan, as part of its 2018 Epistar Strategic Partners Technology Forum. Sagawa’s presentation showcased an innovative phosphor binder material for CSP LEDs
Additionally, Diego Tsai, Epistar’s account manager, along with Lucas Chou and Anna Feng of Dow’s Technical Support team, were recognized as partners delivering innovative solutions, thanks to their collaboration with Epistar to develop solutions like OE-7841 and WR-3100. Because of this accomplishment, Dow was the only packaging material company invited to present at the event.
In addition to presenting at the event, the LED packaging team, led by APT Sales Manager Johnny Chien, was invited to attend the event’s opening banquet, along with other partners and key representatives from Epistar. During his opening speech, Dr. MJ Jou, president of Epistar, shared the company’s perspective on its LED business, including efforts to expand III-IV compound semiconductor’s potential beyond LEDs and into sensors and internet of things devices, while emphasizing the need for partnership to explore these new areas. Dow looks forward to exploring new opportunities through this valuable partnership with Epistar.