Dow Electronic Materials

James Fahey, Business President, to Speak at SEMICON Taiwan 2018

Fahey to Present at IC60 Master Forum; Rozalia Beica to Present at Advanced Packaging Technology Symposium

August 29, 2018

DuPont Electronics & Imaging, part of the Specialty Products Division of DowDuPont, today announced that James Fahey, Ph.D, Business President, and Rozalia Beica, strategic marketing director, will give talks as part of highly anticipated programs set to take place during SEMICON Taiwan, September 5-7, 2018, in Taipei.

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Fahey, business president for Electronics & Imaging, will be the closing speaker for the IC60 Master Forum celebrating the 60th anniversary of the integrated circuit (IC). Fahey’s talk, part of the afternoon “Vision X” series, in which speakers will look into the future of the semiconductor industry, will address the contrasting twin challenges of technology convergence and market expansion. With technologies such as artificial intelligence (AI) and 5G communications expected to be leading drivers over the next decade, materials will play an even greater role in their successful implementation.

“New materials and integrated technologies are at the heart of the future connected world – and that future has already begun,” said Fahey. “With the digital transformation impacting all market segments, semiconductor adoption will continue to grow to meet the demand for devices capable of processing the massive amounts of data that will be generated. Expanded connectivity is enabling smart homes, cars and cities; AI and flexible electronics are growing and finding new synergies; and innovative, quality materials are at the heart of the value chain enabling these advances.”

Rozalia Beica

Rozalia Beica, strategic marketing director for the Electronics & Imaging business, will give her talk during the Advanced Packaging Technology Symposium, at which industry experts from throughout the semiconductor ecosystem will discuss new packaging technologies, applications, challenges and solutions. In her address, Beica will provide an overview of the semiconductor industry and advanced packaging platforms, highlighting the major developments and stressing the critical role that innovation in packaging – including heterogeneous integration of devices and electronic materials – plays in addressing current industry challenges and enabling the coming generation of electronic devices.

The IC60 Master Forum will be held Wednesday, September 5, 2018, from 9:00 a.m. to 5:00 p.m., on the Master Forum Stage, 4F, Hall 1, Taipei Nangang Exhibition Center (Booth M1156). Themed “The Future Starts Here,” the forum is co-organized by the Ministry of Science and Technology (MOST) and SEMI Taiwan.

The Advanced Packaging Technology Symposium will be held Tuesday, September 4, 2018, from 9:00 a.m. to 5:00 p.m., with a reception following, in the Grand Ballroom, Grande Luxe Banquet, 3F, CTBC Financial Park, Nangang, Taipei. Co-moderating the symposium will be Albert Lan, global packaging TD, Applied Materials, and vice chairman, SEMI Taiwan PKG & TEST Committee; and Kim Arnold, executive director, Advanced Packaging Business Unit, Brewer Science.

About DuPont Electronics & Imaging
With the 2017 merger of Dow and DuPont, Dow Electronic Materials and DuPont Electronics & Communications have combined their portfolios and expertise to create the new DuPont Electronics & Imaging business, which is part of the new Specialty Products Division of DowDuPont. DuPont Electronics & Imaging is a global supplier of materials and technologies serving the semiconductor, advanced chip packaging, circuit board, electronic and industrial finishing, photovoltaic, display, and digital and flexographic printing industries. From advanced technology centers worldwide, teams of talented research scientists and application experts work closely with customers, providing solutions, products and technical service to enable next-generation technologies. More information about DuPont Electronics & Imaging can be found at www.dowelectronicmaterials.com or www.dupont.com/corporate-functions/our-company/businesses/electronics-and-communications.html

About DowDuPont Specialty Products Division
The Specialty Products Division of DowDuPont is a global innovation leader with technology-based materials, ingredients and solutions that help transform industries and everyday life. Our employees apply diverse science and expertise to help customers advance their best ideas and deliver essential innovations in key markets including electronics, transportation, building and construction, health and wellness, food and worker safety. DowDuPont intends to separate the Specialty Products Division into an independent, publicly traded company. More information can be found www.dow-dupont.com.

For further information contact:

Shari Samuels
Electronics & Imaging
DowDuPont Specialty Products Division
ssamuels@dow.com

Ina Chu
Kiterocket
ichu@kiterocket.com