Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Examining Unique Plating Challenges of TSVs

January 17, 2017

Cu TSVs present a number of unique plating challenges to optimize performance.

This tutorial examines the concept of copper (Cu) through silicon via (TSV) electroplating, which, when done optimally, increases reliability and decreases cost of subsequent process steps.

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Copper Pillar Electroplating Tutorial

December 08, 2016

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This tutorial examines the requirements and processing considerations for electroplated copper pillars used in advanced chip packaging applications. The key aspects of the plating process and the role of each in achieving the desired design and performance goals are described.

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Copper Electroplating Fundamentals

November 22, 2016

A short tutorial examining the fundamentals of copper plating

This tutorial examines the concept of copper electroplating and how the process works. It also discusses its use in advanced packaging applications like the dual damascene process, TSV, copper pillars, and copper RDL, as well as how feature geometry as well as plating time affect how additives behave.

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The State of EUV Lithography: A Materials Primer

July 19, 2016

Photo of James W. Thackeray, Ph.D.

Extreme ultraviolet (EUV) lithography is the most promising of the post-optical lithography patterning technologies to enable continued shrink, keeping the semiconductor industry on the path of Moore’s law. Dow’s two Litho University℠ video tutorials on EUV are a great place to start learning the fundamentals of EUV technology.

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Enhancing Advanced PCB Performance with Corrosion-Resistant Electroless Nickel

May 24, 2016

Enhancing PCB Performance with Electroless Nickel

PCBs are shipped with a “final finish,” a solderable surface that offers excellent electrical and mechanical connections to IC packages. This tutorial examines current technology, including OSP, ENIG, and immersion tin and silver, and demonstrates how high-phos electroless nickel helps meet the needs of the most advanced PCBs powering today’s electronic devices.

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Is REACH Regulation changing the products you use?

March 29, 2016

Meeting REACH requirements for electronic materials

With REACH regulations now reaching the 10-year mark, manufacturers globally are well on the road to compliance. No longer limited to the EU, many other countries are adopting similar requirements. In this article, we look at Dow’s efforts to meet REACH benchmarks.

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Litho University: DBARC Technology 101

November 18, 2015

Developable Bottom Antireflective Coatings (DBARC)

DBARC offers a viable alternative to BARC for semiconductor manufacturing, as the relentless pursuit of Moore’s law has stretched lithography to its very limits in the attempt to scale to smaller nodes. In this video, Jim Cameron, Ph.D., provides an overview of DBARC and its application for advanced lithography patterning processes.

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Litho UniversitySM: Directed Self-Assembly 101

July 07, 2015

Nanotechnology researchers have been studying self-assembly to enable development of next-generation electronic devices, and directed self-assembly (DSA) is actively being explored for use in the lithography process of semiconductor manufacturing. In this series of videos, Dow’s Dr. Phil Hustad will take you on a journey through the amazing world of DSA.

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