Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

2018 Outlook: A Vision for the Semiconductor Industry in China

March 20, 2018

A woman using her smartphone against the Beijing skyline serves as a  reminder of opportunities for continued growth in China’s semiconductor industry.Dow’s Shuji Ding-Lee talks with Semiconductor Manufacturing China about market dynamics and opportunities for semiconductor industry growth in China in 2018.

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A market outlook: Will OLEDs Prevail in 2018 Display Markets?

March 15, 2018

The display market is exciting with innovative technology on the horizon like flexible OLED displays. The display market is in a period of transition, with LCD displays unstable, QDs a bit unknown and OLEDs seemingly in the driver’s seat. Dow’s Hwang shares his thoughts on this exciting market.

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2018 Semiconductor Industry Outlook: Riding a Growth Trend

March 13, 2018

A businessman sits in a chair contemplating the semiconductor industry outlook.Dow’s Adam Manzonie gives his insight on what may extend the semiconductor industry’s growth in 2018. Overall product quality from material suppliers is key in 2018 to meet ever more stringent process control requirements.

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3D InCites: It’s Time to Get Serious About (Advanced Packaging for) 5G

March 08, 2018

Advanced packaging as the key to 5GDow’s Rob Kavanagh discusses how advanced packaging will be a key asset for the development of 5G and the connectivity of all IoT devices. With the strict design and materials requirements for 5G, this proposes some challenges as well as opportunity for the semiconductor industry.

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Boric Acid-Free Nickel Electroplating: Another REACH Challenge

January 22, 2018

Nickel electroplating using boric acid is no longer EU REACH compliantEU REACH continues to identify and act potentially harmful substances; boric acid and borate salts may face increased restriction. Dow is developing boric acid replacement electrolytes for nickel, with boric acid-free nickel plating already demonstrated.

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Tailoring Copper Plating for Vias on IC Package Substrates

November 28, 2017

CuplatingviasforICpackagesubstrates_v1

IC substrate manufacturers must innovate to be competitive in a landscape where feature dimensions continue to shrink. Copper plating chemistries optimized for IC substrates is one step manufacturers can take toward achieving their production goals.

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How Silver Catalysts Enhance PCB Manufacturing

October 31, 2017

silvercatalystsenhancePCBmanufacturingUsed in many applications, silver catalysts provide a balance of features: good catalytic activity, high electrical conductivity, modest cost, and good process stability. As such, they are increasingly being explored for use in PCB manufacturing.

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Flexible PCBs for Smartphones Need New Metallization Processes

September 26, 2017

Although cell phones aren't flexible, they are increasingly utilizing flexible PCBs to fit all required components into small form factors.

Consumers are demanding ever-more functionality and battery life from their smartphones, which is driving a need for flexible PCBs (FPCBs). This article looks at design considerations of metallization processes for FPCBs, which will enable future devices.

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Press-Fit Solutions Address Future Automotive Reliability Requirements

September 06, 2017

Dow’s solderless press-fit solutions address next generation automotive reliability requirements.Automotive electronics have long had to meet demanding reliability standards. As a result, automotive PCBs, with millions of through holes, are migrating towards solderless press-fit interconnection solutions as an alternative to soldering.

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Advanced Via Fill for HDI Applications

August 01, 2017

Continuous innovation in advanced via fill will enable new HDI applications.The smart phone market is driving improved via fill for HDI substrates, but it will also be needed for several emerging electronics markets. Continuous innovation in copper via fill is needed to meet new requirements.

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