Dow Electronic Materials


Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Developing the Chinese Semiconductor Industry Ecosystem

May 25, 2017

Two people inspect a flexible electronic circuit board at a facility in South China that is part of the growing China semiconductor ecosystem.

With rapid growth occurring in the Chinese semiconductor industry, George Lu posits that the country needs to build out a complete supply chain to compete globally for advanced node manufacturing.

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Role of Additives and Cu Purity in Advanced Package Reliability

May 02, 2017

Cu plating and additives have a major role in achieving advanced package reliability for next-generation mobile devices.

Part 2 of our series on metallization examines the impact high density fan-out (HD FO), 2.5D and 3D packaging has on Cu plating requirements, and the role additives play in meeting requirements for advanced package reliability.

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Market Drivers for Advanced Packaging Metallization

April 04, 2017

Solder bumps used  in advanced packaging metallization.

Advanced wafer-level packaging technologies hold the key to meeting the future needs of electronic devices. This requires advances in electronic materials, and advanced metallization technologies are no exception.

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Advancing the Thick PCB Manufacturing Process for 5G Infrastructure

March 20, 2017

PCB Manufacturing Process for 5G Infrastructure

The demand for thick PCBs is increasing, presenting a challenge and an opportunity for copper plating. Here, we look at how Dow is advancing the thick PCB manufacturing process to support the growth of 5G infrastructure.

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Moving into China: Advances in Next-Generation Displays

March 07, 2017

China is embracing next-generation display technologies

China’s display market is growing rapidly, and if SID hosting its first-ever conference there is any indication, it is well on its way. Kathleen O’Connell offers an overview of her plenary session, explaining how multiple display technologies have room to succeed.

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2017 Outlook: Semiconductor Market Forecast Calls for Continued Collaboration

February 16, 2017

Business executives collaborate on a project in a conference room. This year’s semiconductor market forecast calls for continued industry collaboration.
The semiconductor market forecast is strong for 2017. Dow's Colin Cameron discusses market drivers and the value of continued collaboration in an editorial for Solid State Technology.

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Will Fan-out Panel-Level Packaging Really Happen?

February 14, 2017

Fan-out panel-level packaging offers the advanced semiconductor packaging industry an opportunity for lower-cost, higher-volume manufacturing to enable the next generation of high performance devices.

The advanced semiconductor packaging industry is considering a shift to fan-out panel-level packaging. Here, Dow’s Rozalia Beica and Monita Pau examine the challenges this new technology is facing.

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Why Converting Tin Electroplating Lines Makes Sense Now

February 07, 2017

Converting to new tin electroplating lines provides benefits in cost, quality and environmental safety

Increasing concerns about toxicity and materials waste when tin-plating steel pose compelling reasons to convert existing PSA/ENSA plating lines to MSA, which provides benefits in cost, quality and environmental safety.

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2017 Outlook: Lithography Materials Support Growth in China

January 31, 2017

A tree grows in urban China, representative of growth in many industries. Lithography materials will be an enabler for semiconductor industry growth in China in 2017.

Shuji Ding-Lee discusses the role lithography materials play in enabling next-gen technologies, as well as the growth of China’s IC market and requirements for materials suppliers.

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Transitioning to Chromium-Free Etch Technology for Plating on Plastics

January 24, 2017


Dow reports on its progress towards a plating on plastics (POP) process free from hexavalent chromium to comply with REACH legislation.

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