Dow Electronic Materials

Connectivity

Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Flexible PCBs for Smartphones Need New Metallization Processes

September 26, 2017

Although cell phones aren’t flexible, they are increasingly utilizing flexible PCBs to fit all required components into small form factors.

Consumers are demanding ever-more functionality and battery life from their smartphones, which is driving a need for flexible PCBs (FPCBs). This article looks at design considerations of metallization processes for FPCBs, which will enable future devices.

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Press-Fit Solutions Address Future Automotive Reliability Requirements

September 06, 2017

Dow’s solderless press-fit solutions address next generation automotive reliability requirements.Automotive electronics have long had to meet demanding reliability standards. As a result, automotive PCBs, with millions of through holes, are migrating towards solderless press-fit interconnection solutions as an alternative to soldering.

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Advanced Via Fill for HDI Applications

August 01, 2017

Continuous innovation in advanced via fill will enable new HDI applications.The smart phone market is driving improved via fill for HDI substrates, but it will also be needed for several emerging electronics markets. Continuous innovation in copper via fill is needed to meet new requirements.

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The Future Is Cadmium-Free – Bright and Safe!

July 27, 2017

LEDScreenQuantumDotsA key trend in electronics manufacturing is reducing the use of potentially harmful materials, such as cadmium. As a result, major global display manufacturers are moving away from cadmium-based QDs and committing to adopt cadmium-free QDs technology.

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Inkjet Masking Reduces Gold Usage (and Cost) in Connectors

July 19, 2017

Inkjet masking reduces gold usage and cost in connectors. 

In the electrical connector industry, gold is frequently used because of its conductivity. Given its cost, there is a strong manufacturing need for a more effective masking procedure that can be carried out rapidly and offers improved resolution in reel-to-reel production.

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Developing the Chinese Semiconductor Industry Ecosystem

May 25, 2017

Two people inspect a flexible electronic circuit board at a facility in South China that is part of the growing China semiconductor ecosystem.

With rapid growth occurring in the Chinese semiconductor industry, George Lu posits that the country needs to build out a complete supply chain to compete globally for advanced node manufacturing.

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Role of Additives and Cu Purity in Advanced Package Reliability

May 02, 2017

Cu plating and additives have a major role in achieving advanced package reliability for next-generation mobile devices.

Part 2 of our series on metallization examines the impact high density fan-out (HD FO), 2.5D and 3D packaging has on Cu plating requirements, and the role additives play in meeting requirements for advanced package reliability.

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Market Drivers for Advanced Packaging Metallization

April 04, 2017

Solder bumps used  in advanced packaging metallization.

Advanced wafer-level packaging technologies hold the key to meeting the future needs of electronic devices. This requires advances in electronic materials, and advanced metallization technologies are no exception.

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Advancing the Thick PCB Manufacturing Process for 5G Infrastructure

March 20, 2017

PCB Manufacturing Process for 5G Infrastructure

The demand for thick PCBs is increasing, presenting a challenge and an opportunity for copper plating. Here, we look at how Dow is advancing the thick PCB manufacturing process to support the growth of 5G infrastructure.

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Moving into China: Advances in Next-Generation Displays

March 07, 2017

China is embracing next-generation display technologies

China’s display market is growing rapidly, and if SID hosting its first-ever conference there is any indication, it is well on its way. Kathleen O’Connell offers an overview of her plenary session, explaining how multiple display technologies have room to succeed.

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