Dow Electronic Materials


Connectivity provides insights into the materials that are enabling the next generation of electronic devices. Keep your edge with the latest information about recent developments, our product portfolio, and opinions and viewpoints from our industry experts.

Inkjet Masking Reduces Gold Usage (and Cost) in Connectors

July 19, 2017

Inkjet masking reduces gold usage and cost in connectors. 

In the electrical connector industry, gold is frequently used because of its conductivity. Given its cost, there is a strong manufacturing need for a more effective masking procedure that can be carried out rapidly and offers improved resolution in reel-to-reel production.

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Fine-tuning CMP Slurries for 3D TSV Processes

June 27, 2017


Chemical mechanical planarization (CMP) is a critical element of the 3D through silicon via (TSV) process flow for controlling wafer topography. Here, Dow’s Michelle Ho explains the role of CMP in TSV processes and discusses CMP slurry design for 3D TSVs.

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Dow Electronic Materials’ James T. Fahey to Keynote Inaugural IMAPS SiP 2017 Conference

June 21, 2017

Dow Electronic Materials’ James T. Fahey, Ph.D. will offer a keynote at the inaugural IMAPS SiP 2017 Conference

Dow’s James T. Fahey, Ph.D. will offer the afternoon keynote titled “The Evolution of Electronic Materials and the Information Age,” during the first-ever IMAPS System-in-Package conference. He will examine the semiconductor industry’s evolution and role of electronic materials.

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Developing the Chinese Semiconductor Industry Ecosystem

May 25, 2017

Two people inspect a flexible electronic circuit board at a facility in South China that is part of the growing China semiconductor ecosystem.

With rapid growth occurring in the Chinese semiconductor industry, George Lu posits that the country needs to build out a complete supply chain to compete globally for advanced node manufacturing.

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How Indium Enables Advanced Semiconductor Packaging

May 25, 2017

Indium offers an option for low-temp semiconductor advanced packaging applications.

For a group of emerging electronics applications, high-temperature manufacturing processes pose significant challenges. In this interview, Dow’s experts explain the drivers for its latest SOLDERON plating chemistry leveraging the material properties of indium.

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Dow to Showcase New Metallization Chemistries at ECTC 2017

May 19, 2017

Dow showcasing its metallization and other advanced packaging technologies at ECTC 2016.

Dow is a proud sponsor of ECTC 2017. At this year’s show, we will introduce SOLDERON™ BP Indium 1000 and INTERVIA™ 9000 Cu products. Learn how these new products expand our metallization portfolio for emerging advanced packaging applications.

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Cleaning Up PCB Final Finish: Cyanide-Free ENIG Coatings

May 04, 2017

Cyanide-free ENIG coating technology used in the PCB final finish process is key to initiate next generation ENIG development.

Although there are many potential roadblocks to cleaning up PCB final finishes, reliable cyanide-free ENIG surfaces now deliver low gold porosity and excellent corrosion resistance.

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Role of Additives and Cu Purity in Advanced Package Reliability

May 02, 2017

Cu plating and additives have a major role in achieving advanced package reliability for next-generation mobile devices.

Part 2 of our series on metallization examines the impact high density fan-out (HD FO), 2.5D and 3D packaging has on Cu plating requirements, and the role additives play in meeting requirements for advanced package reliability.

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James Thackeray Named SPIE Fellow

April 13, 2017

James Thackeray, Ph.D., new SPIE Fellow

Dr. Thackeray has been named a SPIE Fellow for his many achievements in lithography materials development over the past decade, many of which have contributed to enabling Moore’s law.

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Market Drivers for Advanced Packaging Metallization

April 04, 2017

Solder bumps used  in advanced packaging metallization.

Advanced wafer-level packaging technologies hold the key to meeting the future needs of electronic devices. This requires advances in electronic materials, and advanced metallization technologies are no exception.

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